Angstrom Sputter System
Angstrom Sputter System
Angstrom Engineering - Custom
MONT
Montana State University
Montana Microfabrication Facility (MMF)
- Thin Film Processing
- Metal
- Sputter
Description
The Angstrom Sputter System is a load locked sputtering deposition system. It can be used to deposit thin metal or dielectric films. This system has three MAK 3 sputterings power by two 1000W RF and one 1000W DC power supplies. The MAK guns are also capable of sputtering magnetic materials such as Iron.
Maximum Substrate Size
6 inch